Which statement about bonding is true?

Bonding is a critical safety practice that helps to ensure that electrical equipment and structures remain at the same electrical potential, which is fundamental in preventing electrical hazards. The true statement that bonding reduces the threat of sideflash highlights its function in mitigating electrical discharge risks.

Sideflash occurs when a high-voltage electrical discharge jumps from a higher potential source to a lower potential conductor or object, potentially causing harm or igniting explosive materials. By bonding various conductive materials together, a more uniform electrical potential is created across these materials, minimizing the chance that a sideflash will occur. This uniformity makes it less likely for electrical energy to seek an unintended path, thereby reducing the overall risk of electrical incidents.

In contrast, the other statements do not accurately convey the role and benefits of bonding. For instance, bonding does not increase the risk of sideflash; in fact, it serves to mitigate that risk. Furthermore, while bonding may involve connecting various conductors, it is not limited to insulated objects or only applicable underground. This demonstrates the comprehensive importance of bonding in electrical safety practices.